2GB DDR2-667 VLP Registered DIMM for Blade Servers

TIM

Transcend Unveils 2GB DDR2-667 VLP Registered DIMM for Blade Servers

Transcend Information Inc. (Transcend), a global leader in the manufacture of memory modules, is proud to release its latest product: professional-grade 2GB DDR2-667 VLP (Very Low Profile) ECC Registered memory modules. At less than 3/4 of an inch high, these modules are 40% lower than standard memory, making them appropriate for use in 1U (or thinner) blade servers and embedded systems with space restrictions. Thanks to its low profile design, the VLP DIMM can be installed in vertical memory slots rather than the traditional 45-degree angle server memory slots. Vertical orientation helps maximize usable space in the chassis, improve airflow and heat dissipation, and allows for the installation of more memory modules.

Transcend’s 2GB DDR2-667 VLP Registered DIMMs use robust eight-layer PCBs with a height of only 0.72 inch which still meets JEDEC (the Joint Electron Device Engineering Council) standards, and can be used in low profile and normal-height systems. The 2GB VLP DIMMs are made of 18 brand name 256Mx4 DDR2 FBGA (Fine-Pitch Ball Grid Array) chips. Each chip is selected with the strictest quality standards and is manufactured using small FBGA packages to assure better thermal dissipation, electrical efficiency and overall computing quality. As opposed to traditional server memory with standard ECC, Transcend’s 2GB DDR2-667 VLP Registered modules incorporate IBM’s advanced new Chipkill™ technology. With Chipkill, DIMMs are able to check and correct multi-bit errors from a single memory chip, whereas standard ECC is only able to correct one-bit errors. This can significantly imcrease data reliablity, which is especially important for heavy-duty server applications running complex tasks. All these benefits make Transcend’s 2GB DDR2-667 VLP Registered DIMMs the best memory solution for any-size server.

Product Features
Huge 2GB capacity
Very Low Profile DIMM – only 0.72” in height
Designed for use in 1U (or thinner) blade servers
Can be installed in vertical memory slots to improve heat dissipation
ECC (Error Correcting Code)
Supports advanced IBM Chipkill Technology
100% tested for speed, stability and reliability
JEDEC standard design for maximum compatibility
FBGA packages allow better electrical efficiency and thermal dissipation
Robust eight-layer PCB
RoHS compliant
Lifetime warranty