Highest Capacity 4GB DDR2-667 Fully Buffered DIMM

TIM

Transcend Releases the Highest Capacity 4GB DDR2-667 Fully Buffered DIMM

Transcend Information, Inc. is moving ahead with its latest Fully Buffered DIMM memory module (FB-DIMM), topping out at a massive 4GB. Still only a mere 1.2 inches high, this small PCB is perfect for Intel’s latest chipsets (5000P/V/X). Transcend’s 4GB FB-DIMM can reach a capacity of 64GB with Intel’s 5000P/V/X chipset, which features a dedicated FB-DIMM memory controller. This high capacity FB-DIMM is fully compatible with IBM X3400/ X3500/ X3550/ X3650 series, HP Proliant DL 360 G5/ 380 G5 series and Dell Precision Workstation 490/ 690 series.

FB-DIMM technology allows greater memory capacities and higher bandwidths due to the addition of an Advanced Memory Buffer (AMB) on each DIMM board. The new FB-DIMMs communicate in serial mode with the memory controller (chipset), which means fewer channel pins and simultaneous read-write cycles; thus eliminating the read-to-read delay. In addition, when compared to DDR2-400, there is a theoretical throughput increase of 300%. FB-DIMM is an exceptionally cost-effective solution that combines increased memory density with faster data rates.

Transcend 4GB DDR2-667 FB-DIMMs use 256Mx4 Fine-Pitch Ball Grid Array (FBGA) chip packages with a full DIMM heat-spreader for improved electrical and heat dissipation. Transcend’s superior design results in highly stable and reliable systems. The low profile module is the best choice for high-end servers and computers.

Transcend memory undergoes rigorous laboratory testing to ensure the highest performance and reliability. Every Transcend memory module comes with a lifetime warranty, a global service network, and Transcend’s commitment to high quality, cost-effective, and stable solutions. Transcend memory modules are well known for their superior standard, outstanding performance, and excellent compatibility.

Product Features
DDR2-533/667 Fully Buffered DIMM, 1.2-inch low profile
Full DIMM Heat Spreader
Compliant JEDEC standard
High compatibility and reliability
FBGA chip packages for improved electrical and heat dissipation characteristics
Support MemBIST (for testing SDRAMS)
Ten-layer PCB
Lifetime warranty