ตอบ: Sat Mar 15, 2008 2:06 pm ชื่อกระทู้: 1GB DDR2-533 Micro-DIMM Memory Module
Transcend Information, Inc. is proud to announce the release of its 1GB Hi-Speed DDR2-533 Micro-DIMM Memory Module for Notebooks that use Intels Centrino Duo platform. The 1GB DDR2-533 Micro-DIMM Module is designed, so that it is only 65 per cent the size of a regular SO-DIMM (Small Outline DIMM) commonly used in notebooks, but has the same memory capacity. The introduction of this higher capacity 1GB module will further accelerate the manufacture of lighter and smaller Notebooks such as, LGs T1 Express Dual, which has enhanced functionality and longer battery life.
Transcends Micro-DIMMs use the latest 214-pin mezzanine connector technology, which reduces the size of the module by approximately 40 percent when compared with an SO-DIMM. Transcends 256MB to 1GB DDR2-533 Micro-DIMMs improve performance considerably and increase your systems overall stability. All of Transcends DDR2-533 memory modules follow the standard developed by JEDEC (the Joint Electron Device Engineering Council), the memory industrys standards organization. Using a Transcend DDR2 Micro-DIMM module in your Notebook will provide you with significant benefits, including lower power consumption, which can improve battery life and help achieve better overall performance.
Transcends memory modules are built to the highest specifications with the best chips and materials. All our modules undergo rigorous laboratory testing to ensure they provide the highest performance and reliability. Transcends memory modules are recognized for their higher quality, outstanding performance, excellent compatibility, and superb reliability and stability. Trust in the best and achieve the most from your systems by choosing a Transcend memory module.
Hi-Speed, High Capacity 1GB DDR2-533 Micro-DIMM Memory Module
1.8 V Operating Voltage, reducing power consumption by around 50 percent compared with DDR
On-Die Termination (ODT) technology to minimize memory signal reflections at higher speeds
FBGA chip packages for improved electrical and heat dissipation characteristics
Excellent compatibility and reliability
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