High Performance 512MB/1GB DDR2-533/667 Fully Buffered DIMM

MemoryToday · Site Admin เข้าร่วมเมื่อ: Apr 05, 2006 ตอบ: 16

Transcend Releases High Performance 512MB/1GB DDR2-533/667 Fully Buffered DIMM (1.2-inches)

Transcend Information, Inc. release its latest low profile DDR2-533/667 Fully Buffered DIMM memory module (FB-DIMM). At a mere 1.2 inches high, this small PCB meets the toughest requirements of ever-shrinking systems. The 512MB/1GB modules are for use with next generation high-end servers and meet the highest specifications for minimal signal disturbance, and enhanced overall performance. FB-DIMM is suited to the Intel’s latest Itanium CPUs that features a built-in FB-DIMM memory controller.

The main difference between FB-DIMM and a regular registered DIMM is that on FB-DIMM the communication between the memory controller (chipset) and the module is serial. This means fewer pins and therefore an increased in overall throughput. In addition, the FB-DIMMs can read and write simultaneously eliminating the read-to-read delay, and offering much faster data rates. In addition combined with an increase in memory density, offers a cost-effective solution without compromise.

Transcend DDR2-533/667 FB-DIMM use 64Mx8 Fine-Pitch Ball Grid Array (FBGA) chip packages with a full DIMM heat-spreader for improved electrical and heat dissipation. Transcend’s superior design results in highly stable and reliable systems. The low profile modules are the best choice for high-end servers and computers.

Transcend memory undergoes rigorous laboratory testing to ensure the highest performance and reliability. Every Transcend memory module comes with a lifetime warranty, a global service network, and Transcend’s commitment to high quality, cost-effective, and stable solutions. Transcend memory modules are renown for their superior standard, outstanding performance, and excellent compatibility.

Product Features
DDR2-533/667 Fully Buffered DIMM, 1.2-inch low profile
Full DIMM Heat Spreader
Compliant JEDEC standard
High compatibility and reliability
FBGA chip packages for improved electrical and heat dissipation characteristics
Support MemBIST (for testing SDRAMS)
Six-layer PCB
Lifetime warranty